产品制程能力及技术标准
项目/ltem | 批量/Mass Production | 样品/Prototype |
表面处理/Surface Treatment | 喷锡(含无铅)/HASL(LF) | 喷锡(含无铅)/HASL(LF) |
沉金/Immersion Gold | 沉金/Immersion Gold | |
电金/Flash Gold | 电金/Flash Gold | |
抗氧化/OSP | 抗氧化/OSP | |
沉锡/Immersion Tin | 沉锡/Immersion Tin | |
沉银/Immersion Silver | 沉银/Immersion Silver | |
喷锡+金手指/HASL&Gold Finger | 喷锡+金手指/HASL&Gold Finger | |
选择性镍金/selective nickel | 选择性镍金/selective nickel | |
喷锡(含无铅)厚度 | PAD位/smt Pad:>3um | PAD位/smt Pad:>4um |
HASL(LF) | 大铜面/Big Cu:>1um | 大铜面/Big Cu:>l.5um |
沉锡/Immersion Tin | 0.4-0.8um | 0.8-1.2um |
沉金/Immersion Gold | 镍厚/Ni:2-5urn | 镍厚/Ni:3-6urn |
金厚/Au:0.05-0.10um | 金厚/Au:0.075-0.15um | |
沉银/Immersion Silver | 0.2-0.6um | 0.3-0.6um |
抗氧化/OSP | 0.1-0.4um | 0.25-0.4um |
电金/Flash Gold | 镍厚/Ni:3-6urn | 镍厚/Ni:3-6urn |
金厚/Au:0.01-0.05um | 金厚/Au:0.02-0.075um | |
板料/Laminates | CEM-3、PTFE | CEM-3、PTFE |
FR-4(高Tg等)FR-4(HighTG etc) | FR-4(高Tg等)FR-4(HighTG etc) | |
金属基板(铝,铜等)Metal Base(Al、Cu etc) | 金属基板(铝,铜等)Metal Base(Al、Cu etc) | |
Rogors、etc | Rogors、etc | |
最大层数/Max Layers | 12(Layers) | 18(Layers) |
最大版面尺寸 | 20"X48" | 20"X48" |
板厚/Board Thickness | 0.4mm-4.0mm | <0.4mm或>4.0mm |
最大铜厚/Max Copper Thickness | 内层/inner Layer:4oz | 内层/inner Layer:5oz |
外层/Outer Layer:5oz | 外层/Outer Layer:5oz | |
最小线宽/Min Track Width | 4mil/0.1mm | 3mil/0.076mm |
最小线隙/Min Track Space | 4mil/0.1mm | 3mil/0.076mm |
最小钻孔孔径/Min Hole Size | 8mil/0.2mm | 6mil/0.1mm |
最小激光钻孔孔径/Min Laser Hole Size | 4mil/0.1mm | 3mil/0.076mm |
最小孔壁铜厚/PTH Wall Thickness | 0.8mil/20um | 1.2mil/30um |
孔径公差/PTH Dia.Tolerance | ±3mil/±76um | ±2mil/±50um |
板厚与孔径比/Aspect Ratio | 6:1 | 10:1 |
阻抗控制/lmpedance Control | ±10% | ±5% |